COB, SMD, MIP and IMD
COB, SMD, MIP and IMD are the different ways the LEDs are mounted and packaged on a dvLED panel. Surface mount places individual LEDs on the board, chip on board seals the chips under a protective surface, integrated packages combine several pixels in one component, and micro LED in package points to the finest pitches. Each has a place depending on pixel pitch, durability and budget.
At a glance
- These are the ways LEDs are mounted and packaged on the panel.
- Surface mount suits value and larger pitches, chip on board suits fine pitch and durability.
- Integrated packages ease fine pitch service, micro LED in package targets the finest pitches.
- The right choice follows pitch, environment and budget.
SMD, surface mount device
Surface mount places individual red, green and blue LEDs onto the panel surface. It is mature, cost effective and well suited to medium and larger pixel pitches. At very fine pitches the small, exposed LEDs become more delicate.
COB, chip on board
Chip on board mounts the bare LED chips directly on the board and seals them under a smooth protective resin. That surface is far more robust, handles heat well, reaches deep contrast and suits fine pitches and high traffic areas such as floors.
The honest trade offs: because mounted dies cannot be binned and sorted the way packaged LEDs can, calibration is more complex and raw panel uniformity is typically lower, which is exactly why hardware level calibration such as the Color Space Engine matters on COB. And since sub pixels cannot be replaced individually, repairs happen at module level rather than pixel level. SMD and IMD panels can additionally be ordered with a GOB protective coating, which adds impact, dust and moisture protection for high traffic and outdoor use.
IMD, integrated matrix device
Integrated packages combine several pixels, often four, into one small component. This sits between surface mount and chip on board, giving good fine pitch performance with straightforward manufacturing and service.
MIP, micro LED in package
Micro LED in package places very small LED chips into individual packages that are then mounted on the panel. It is a practical route toward micro LED at fine pitches, with strong uniformity and color and room to scale.
| Technology | How it works | Best for |
|---|---|---|
| SMD | Individual LEDs on the surface | Medium and larger pitches, value |
| COB | Chips sealed under resin | Fine pitch, durability, floors |
| IMD | Several pixels in one package | Fine pitch with easy service |
| MIP | Micro LED chips in packages | Finest pitches, uniformity |
How to choose
The right technology follows the pitch, the environment and the budget. TRUE develops and produces panels across these technologies and selects the LEDs, drivers and boards component by component, so the choice is made on merit for your project rather than on what one supplier happens to stock.
COB, SMD, MIP and IMD: common questions
What is the difference between COB and SMD?
Surface mount places individual LEDs on the panel surface, which is cost effective for medium and larger pitches. Chip on board seals the LED chips under a protective resin, which is far more robust, reaches deeper contrast and suits fine pitches and high traffic surfaces.
Which LED technology is best for a floor or high traffic area?
Chip on board, because its sealed resin surface is durable and resists impact and pressure, which makes it well suited to walkable floors and busy environments.
Is MIP the same as MicroLED?
Micro LED in package is a way to bring micro LED chips to market at fine pitches by placing them in individual packages before mounting. It uses micro LED technology and is one of the practical paths toward full micro LED displays.
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